8th International Conference on
Processing and Characterization
of Materials ICPCM 2026
Join leading global researchers and industry peers to explore the latest innovations, technological advancements, and sustainable practices in materials science.
About ICPCM 2026
The Department of Metallurgical and Materials Engineering at the National Institute of Technology is pleased to announce the 8th edition of the International Conference on Processing and Characterization of Materials (ICPCM 2026). This conference aims to serve as a premier platform for fostering scientific dialogue and promoting collaboration between academia and industry. Since its inception, ICPCM has been held annually, consistently achieving success in facilitating knowledge exchange, enabling technology transfer, enhancing academia-industry partnerships, and promoting collaborative research. The conference brings together researchers, scientists, engineers, and industry professionals from around the world to share recent advancements and innovations in materials processing and characterization. ICPCM 2026 will also provide a valuable opportunity for emerging researchers to gain insights and inspiration from distinguished experts, fostering the development of new ideas and research directions.
Scope & Scope Areas
Thematic Fields
Mineral Processing, Extractive and Process Metallurgy | Advances in Ferrous and Non-Ferrous Metallurgy | Surface Engineering, Corrosion & Tribology |
Polymer, Ceramic, and Composite Materials | Advanced Materials and Functional Materials | Materials in extreme environments |
Failure Analysis, Detection, and Mitigation | Computational Materials Science and AI/ML in Material Science | Critical Mineral Processing |
Conventional and Additive Manufacturing Processes | Sustainable recycling and waste-to-wealth circular economy | Materials for energy storage and renewable energy |
Our Invited Speakers
Prof. Lukas Bichler
University of British Columbia, Canada
Prof. Rajesh Prasad
Indian Institute of Technology, Delhi, India
Prof. Jürgen Eckert
University of Leoben, Austria
Prof. Dr.-Ing. Horst Hahn
Karlsruhe Institute of Technology, Germany
Prof. Ramamoorthy Ramesh
Rice University, USA
Prof. Michael R. Wisnom
University of Bristol, UK
Prof. Jon Binner
University of Birmingham, UK
Prof. Anish Upadhyaya
Indian Institute of Technology, Kanpur, India
Dr. A. K. Singh
Former Scientist, DMRL, Hyderabad, India
Prof. Suryasarathi Bose
Indian Institute of Science, Bangalore, India
Dr. Radhakanto Rana
Tata Steel, Netherlands
Prof. Ashok Mandal
Indian Institute of Technology, BHU, India
Prof. Suhrit Mula
Indian Institute of Technology, Roorkee, India
Dr. Mrinal Pal
Scientist, CSIR-CGCRI, India
Dr. Pratik Ray
Indian Institute of Technology, Ropar, India
Prof. Nagamani Jaya
Indian Institute of Technology, Bombay, India
Prof. Lakshmi N. Ramasubramanian
Indian Institute of Technology, Delhi, India
Dr. Subrata Mukherjee
Tata Steel, India
Poulami Chatterjee
Airbus, India
Partner Opportunities
Sponsorship Packages
“Establish your brand as an industry leader in materials engineering. Select from our premium packages or contact us to tailor a custom plan that fits your corporate marketing goals.”
Partners & Collaborators
Our Past Sponsors
We are proud to have been supported by leading industry innovators and research organizations globally.
8th International Conference on
Processing and Characterization
of Materials
Dec 3-5, 2026 | Department of Metallurgical and Materials Engineering, NIT Rourkela, Odisha, India – 769008
Schedule & Registration
Important Dates & Fees
Mark your calendars and view our registration tiers.
| Information | Dates |
|---|---|
| Abstract Notification Starts | July 1, 2026 |
| Abstract Submission Closes | August 31, 2026 |
| Registration Opens | October 16, 2026 |
| Deadline for Early Bird Registration | November 10, 2026 |
| Deadline for Late Registration | November 30, 2026 |
| Full Paper Submission | To be notified soon |
| Conference | December 3–5, 2026 |
* Full-length papers will be considered for publication
in the proceedings after the conference.
| Category | Early Registration (up to Nov 10, 2026) | Late Registration (Nov 11 – Dec 3, 2026) |
|---|---|---|
| Presenting Students | ₹ 7,000 | ₹ 8,000 |
| Presenting Delegates from Academia and R&D Labs | ₹ 8,000 | ₹ 10,000 |
| Presenting Delegates from Industries | ₹ 10,000 | ₹ 12,000 |
| Presenting International Delegates (Online) | US$ 150 | US$ 200 |
| Metallography / Posters | ₹ 4,000 | ₹ 5,000 |
| Attendee & Accompanying Persons | ₹ 3,000 | ₹ 4,000 |
* Registration Fee (including GST)
Our Team
Conference Core Committee
Prof. K. Umamaheshwar Rao
Prof. Debasis Chaira
Prof. Soumitra Kumar Dinda
Prof. Arnab Sarkar
Prof. Srijan Acharya
Chief Advisors
Prof. Bankim Chandra Ray
Prof. Atanu Bhowmick
Organizing Committee
Prof. Ajit Behera
Prof. Anindya Basu
Prof. Ankush Arun Kashiwar
Prof. Anshuman Patra
Prof. Archana Mallik
Prof. Krishna Dutta
Prof. Kumud Kant Mehta
Prof. Natraj Yedla
Prof. Prakash Gulabrao Ranaware
Prof. Prekshya Nath
Prof. Priyanka Saini
Prof. Rajesh Kumar Prusty
Prof. Santosh Kumar Sahoo
Prof. Shweta Shukla
Prof. Syed Nasimul Alam
Discover Rourkela & Venue
About the Venue
Metallurgical & Materials Engineering Location
Department of Metallurgical and Materials Engineering, NIT Rourkela Campus
Visiting Gallery
Explore campus locations and scenic spots in Rourkela
How to Reach NIT Rourkela
By Rail (Rourkela Station - ROU)
Rourkela is a major railway hub on the Howrah-Mumbai line. Cabs and auto-rickshaws are readily available at the station exit 24/7.
By Air (Jharsuguda Airport - JRG)
Jharsuguda (Veer Surendra Sai Airport) has regular flights connecting major Indian cities. Excellent highway connectivity (cab/bus) to Rourkela takes about 2.5 hours.
By Air (Ranchi Airport - IXR)
Birsa Munda Airport in Ranchi offers extensive flight connectivity. You can take a direct train or hire a cab to travel to Rourkela via NH143.
Local Attractions & Commute
Local Commute Options
Prepaid taxis, app-based cabs, and autos are 24/7 available outside Rourkela Station (ROU) to Sector-1 NIT Campus.